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Name :

 

 

Country :

 

 

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Circuit board specifications

 

 

 

Quantity:

  

 

Number of layers:

 

 

Circuit dimension:

  

 

Minimum width conductor:

  

 

Minimum spacing:

 

 

Qty board / waffle:

 

 

Waffle dimension:

 

 

V Groove:

 

 

No. of sides (SMT):

 

 

 

 

 

 

Plating specifications

 

 

 

Copper Thickness:

 

 

Electroless gold:

 

 

Soldermask Specifications:

 

 

Silkscreen specifications:

 

 

 

 

 

 

Material Specifications

 

 

- Type:

FR4

G30

 

 

 

 

 

 

Rogers 4003

Other

 

 

Thickness in inches:

 

 

Specific thickness:

 

 

 

 

 

 

Drilling specifications

 

 

 

Hole Qty:

 

 

Type of hole:

Blind Via

Buried Via

 

 

Gold connector:

 

 

Electrical test:

 

 

Impedance Report:

 

 

 

 

 

 

Comments :

 

 

 

 

 

 

 

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